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BYD has unveiled the Xuanji A3, a self-developed 4nm intelligent driving SoC now in mass production that supports L3 and L4 autonomous functions. The move is part of a broader push to accelerate its advanced driver assistance business, leveraging vertical integration—thousands of in-house chip SKUs, five wafer fabs, multiple manufacturing stages, and a 7,000-person chip R&D team. BYD claims multi-chip configurations top 2,100 TOPS and improved compute utilization through algorithmic tuning. Together, these developments signal BYD’s strategic shift to control both hardware and software stacks, aiming to commercialize higher-level autonomy across its EV lineup.
BYD moving to a self-developed 4nm SoC alters supplier dynamics and raises the bar for vertically integrated EV makers. Tech teams should reassess system architecture, software integration, and validation efforts when OEMs control both compute and algorithms.
Dossier last updated: 2026-05-28 17:38:17
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At BYD’s smartification strategy event, founder Wang Chuanfu unveiled the company’s self-developed 4nm driving chip, Xuanji A3 — billed as China’s first 4nm intelligent driving SoC — now in mass production and supporting L3 and L4 automated driving. BYD says a three-chip configuration exceeds 2100 TOPS and that its algorithmic optimizations double compute utilization. The announcement highlights BYD’s vertical integration: over 2,000 in-house chip SKUs, five wafer fabs, seven in-house manufacturing steps from design to packaging, and a 7,000-strong chip R&D team with multi-billion-yuan investment. The move positions BYD to control both software and hardware stacks for advanced driver assistance and higher-level autonomy in its EVs.