SK hynix to Double Memory and Wafer Capacity

Debby Wu / Bloomberg : SK Hynix Chair Chey Tae-won says the company plans to double its memory chip capacity over the next five years, responding to a shortage that could last to 2030 — SK Hynix Inc. plans to double its memory chip capacity over the coming half-decade, a major expansion that should help ease …

SK Hynix chairman Chey Tae-won said on June 2 that the company plans to double its wafer production capacity within five years, and warned that memory chip capacity constraints could persist through 2030. The announcement signals an aggressive expansion push by the South Korean memory-chip giant to address long-term demand and supply bottlenecks in DRAM and NAND production. If realized, the capacity expansion would affect global memory supply chains, equipment vendors, and cloud and consumer electronics makers that rely on DRAM and flash. The plan underscores continued capital investment cycles in semiconductor manufacturing amid sustained demand for AI, data-center, and mobile applications.

SK Group chairman Chey Tae-won said SK Hynix plans to double wafer production capacity within five years to address a storage shortage driven by AI demand. Chey warned the storage supply crunch could persist until 2030 and promised large-scale capital raising and equipment investment despite rising costs for land, power, water and tools. He emphasized that expanding wafer capacity requires securing funding, energy, GPUs and other inputs, and that new fabs take years to build—three years at minimum or five-plus from greenfield. The announcement follows SK Hynix joining peers in surpassing $1 trillion market value amid AI-driven sector gains.